# Silicon deep reactive ion etcher (Si DRIE)

- **Source:** TED · `562633-2025`
- **Buyer:** Danmarks Tekniske Universitet - DTU
- **Published:** 2025-08-28
- **Deadline:** 2025-09-26
- **Estimated value:** —
- **CPV codes:** 38000000, 51430000
- **Place-of-performance NUTS:** DK012, DNK
- **Buyer-address NUTS:** —
- **Notice type:** cn-standard / 16

## Procedure details

Source lists may span several lots; list positions do not establish relationships.

### Procedure Types

- open

### Award Criterion Names

- Price
- Functionality and Performance
- Quality of submitted samples

### Award Criterion Descriptions

- The price to be evaluated is the total price for the machine as well as the options, but not voluntary option, specified in Appendix 2 - Prices. DTU uses a linear point scale model to evaluate the tender prices. The linear model implies that the prices offered are converted into points.
- The sub-criteria "Functionality and performance" is based on the Tenderer's specifications in Appendix 1 - Requirement Specification.
- Evaluation of the sub-criteria "Quality of submitted samples" will be made based on an evaluation of the received samples.

### Submission Urls

- https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=439360&B=

## Description

DTU Nanolab requires a silicon deep reactive ion etcher (Si DRIE) to become its new primary instrument for 150 mm wafer processing. Delivery is expected no later than Q4 2026. The Instrument will be installed in the DTU Nanolab cleanroom - a university facility providing a comprehensive suite of micro- and nanofabrication tools. It serves a diverse community of over 200 active users, ranging from novice students to experienced researchers, as well a high percentage of commercial clients.

## Original notice

https://ted.europa.eu/da/notice/-/detail/562633-2025