# DUV Stepper

- **Source:** TED · `164801-2026`
- **Buyer:** Danmarks Tekniske Universitet - DTU
- **Published:** 2026-03-10
- **Deadline:** —
- **Estimated value:** 6,675,000 EUR
- **CPV codes:** 31700000, 31000000, 42000000, 42900000, 42990000, 73300000
- **Place-of-performance NUTS:** DK012, DNK
- **Buyer-address NUTS:** —
- **Notice type:** can-standard / 29

## Procedure details

Source lists may span several lots; list positions do not establish relationships.

### Procedure Types

- neg-wo-call

### Award Criterion Names

- 100%

### Award Criterion Descriptions

- This contract is awarded directly to a bidder based on quality.

### Options

- Options Hardware: 2-1) TSA (Through Silicon Alignment) option 2-2) Z-SPIN Reticle (875-03) 2-3) 6inch Flat /8inch Notch multi-inch size special wafer chuck 2-4) 6inch Flat /8inch Notch multi-inch size special wafer chuck (Spare) 2-5) Secondary flat dedicated 6inch wafer chuck 2-6) Secondary flat dedicated 6inch wafer chuck 2-7) 6inch/8inch multi-inch size special wafer handling kit 2-8) Reticle Cassettes (for 6inch, 14pcs) Software: 2-9) PENSVA, PENSVABAR 2-10) Manual TVPA (MATVFUNC) 2-11) License package for transparent wafers (CHTRPA. SIONGIN) 2-12) AUTOPM (AUTOPM, QBLOCK) 2-13) Video Server (RAAMON) 2-14) PC Remote Console (Multi) *Hardware needs to be prepared by DTU 2-15) Recipe Server Software *Hardware needs to be prepared by DTU

## Description

To ensure the continuation of small and medium sized companies chip production and development in Danmark DTU Nanolab want to purchase a new (non-refurbished) DUV stepper using a 248 nm wavelength laser as illumination source (KrF laser unit from CYMER). It must furthermore be possible to handle several different wafer types and sizes: Wafer materials: Silicon, LNOI, Borofloat, quartz, III-V Wafer sizes in diameter: 100mm, 150mm and 200mm, furthermore it must be equipped with a multi wafer handling kit such that easy switching between at least 150mm and 200mm wafers is possible without longer downtime for reconfiguration of the equipment. Wafer thickness to be handled are from 350µm up to 1000µm and they can come with a bow up to at least +/- 200um for some wafers. As well as wafers with either notch or primary and secondary flats. It should also be equipped with a through silicon alignment possibility. The equipment must further have the possibility of off-axis as well as dipole illumination. Reuse of existing reticles and easy transfer of existing job files from the DUV stepper FPA-3000EX4 are essential. Due to space restriction the footprint of the main body must not exceed 2000mm x 3000mm x 2700mm (W x D x H).

## Award result

- **Published notice total:** 6,675,000 EUR
- **Contract concluded:** 2026-02-19
- **Winner:** Canon Europe N.V. (CVR NL005916343B01) · value 6,675,000 EUR
Published values may cover multiple lots, options and frameworks; they are not supplier revenue. Unlinked notice summaries do not assign each value or expiry to each winner.

## Original notice

https://ted.europa.eu/da/notice/-/detail/164801-2026