# Blade Dicing Saw

- **Source:** TED · `581505-2026`
- **Buyer:** Danmarks Tekniske Universitet - DTU
- **Published:** 2026-08-24
- **Deadline:** —
- **Estimated value:** —
- **CPV codes:** 38000000
- **Place-of-performance NUTS:** —
- **Buyer-address NUTS:** —
- **Notice type:** veat / 25

## Procedure details

Source lists may span several lots; list positions do not establish relationships.

### Procedure Types

- neg-wo-call

## Description

DTU Nanolab intends to procure a semi-automatic wafer dicing system for research and cleanroom operations. The equipment must be capable of processing wafers up to 300 mm diameter and support conventional wafer dicing, circular wafer cutting, multi-circular cutting, and edge trimming of circularly cut wafers to improve mechanical strength and handling robustness. The system must also be capable of processing hard and thick materials used in advanced microfabrication and semiconductor research, including materials such as silicon carbide (SiC) and piezoelectric substrates. The equipment will be installed and operated in DTU Nanolab's multi-user cleanroom environment and will support research, innovation, and industrial collaboration activities.

## Original notice

https://ted.europa.eu/da/notice/-/detail/581505-2026