Automatisk Bonder

Vi har brug for én automatisk bonder (sy-maskine med metaltråd som bruges til produktion og test and mikro-kredsløb). Udstyret skal leveres og installeres på Blegdamsvej. Firmaet skal oplære og supportere i fremtiden. Automatic bonding Especially for the R&D and engineering part of our work, fast and reliable bonding is essential. Automatic bonding both saves many work hours and produces more reliable results than manual or semi-automatic bonding does. Al wedge bonding For our superconducting qubit platform, it is essential that our bond wires also turn superconducting at mK temperatures. This is indeed the case for regular Si-doped Al bond wire. This wire is also usually used for semiconducting qubits. Au ball bonding For our photonic platform, on the other hand, Au ball bonding is required. Ball bonding applies less mechanical force. Some of the photonic structures are fragile and others have a risk of leaking to deeper layers in the heterostructure. Fast switching of the full bonding head including wedge and wire. We expect to have many daily uses of the bonder, using both types of wire. It is therefore crucial that the switch between the two is very fast (below 10 min) and with minimal risk of user mistakes (eg. while threading and needle change) affecting the bonding parameters. Having a detachable bonder-head (thread, needle, mechanics) is therefore ideal. The detachable bonder-head is furthermore relevant since it allows for easy upgrades in the future for the same machine such as: • Deep Access Wedge-Wedge • Ball-Wedge • Heavy wire • Automatic bond testing (pull/shear or BAMFIT) Bond process control: Getting bond quality feedback (eg. via wire deformation measurements) while bonding is great for fast troubleshooting. University of Copenhagen 4 Wire clamp tear motion A gentle way for making second bonds is by doing the tear motion with the wire clamp while the bond head is still. This is needed for some of our fragile components. Good ultrasound control Having good control of the ultrasound is crucial for consistent bonding. We are therefor looking for a machine that has a digital ultrasound generator and does ultra sound health checks.