Silicon deep reactive ion etcher (Si DRIE)

DTU Nanolab requires a silicon deep reactive ion etcher (Si DRIE) to become its new primary instrument for 150 mm wafer processing. Delivery is expected no later than Q4 2026. The Instrument will be installed in the DTU Nanolab cleanroom - a university facility providing a comprehensive suite of micro- and nanofabrication tools. It serves a diverse community of over 200 active users, ranging from novice students to experienced researchers, as well a high percentage of commercial clients.