Purchase of Blade Dicing Saw

DTU requires a blade dicing tool for die singulation substrates of various materials up to Ø=300mm. The supply should include a semiautomatic tool, and should offer both manual and automatic alignment, and capable of precise and repeatable alignment singulation. In addition to square die singulation, it should also be able to downsize wafers, restore sample edges, trimming edges for wafer-grinding, and polishing sample edges for an optically smooth finish. The supplier should also be able to provide long term support, and offer assistance for repair, training and process optimization.